| abstract |
The present invention provides a photosensitive resin composition with which a dry resist film can be obtained, the dry resist film exhibiting excellent storage stability and migration resistance in thickness direction thereof. This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; and a thermosetting agent. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80℃ or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. (In formula (1), R 1 , R 2 , X 1 , X 2 , and n are as defined in the description.) |