http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018125905-A1

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filingDate 2017-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8decbcf62ee4c133767c6185515b2c79
publicationDate 2018-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2018125905-A1
titleOfInvention Polishing compositions
abstract The present disclosure provides chemical mechanical polishing compositions that achieve minimal dishing at reduced dishing reducer (DR) levels when compared to known CMP compositions. The compositions of the disclosure include a dynamic surface tension reducer (DSTR) which allows for lower levels of dishing reducer in the compositions. Indeed, the compositions of the disclosure allow for lower levels of dishing reducer to achieve the same dishing as known compositions having higher levels of dishing reducer. Deleterious effects of high DR levels are thereby avoided or minimized when employing the compositions of the disclosure.
priorityDate 2016-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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