| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07df74462e6193cbf71c250f0d4590e7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate |
2017-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fb2b0dd60adbf0261465cbb0ea3870a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecf5696f1d524c02edae6c1552ab18f9 |
| publicationDate |
2018-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018123370-A1 |
| titleOfInvention |
Semiconductor device |
| abstract |
Provided is a semiconductor device which has excellent heat dissipation properties and excellent electromagnetic wave suppressing effect. In order to solve the above-described problem, a semiconductor device 1 according to the present invention is characterized by being provided with: a semiconductor element 30 that is formed on a substrate 50; a conductive shield can 20 that has an opening 21 and is arranged so as to cover at least a part of the semiconductor element 30, while being connected to a ground 60; a cooling member 40 that is arranged above the conductive shield can 20; and an electromagnetic wave-absorbing heat transfer sheet 10 that is formed between the semiconductor element 30 and the cooling member 40 at least through the opening 21 of the conductive shield can 20. |
| priorityDate |
2016-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |