http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018122831-A2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e9363daf70f7239ffd12cea64f833b6c |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P2015-0882 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P1-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P2015-0862 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P2015-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P1-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P1-003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-08 |
| filingDate | 2018-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd31a2c84da90ae9eb54262b606f6e9a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90f92eeedb4b443eaa7ca4b3a78910c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f55fad4b0279f233e651c8dbbccc2a52 |
| publicationDate | 2018-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2018122831-A2 |
| titleOfInvention | Decoupling structure for accelerometer |
| abstract | Accelerometer comprising a decoupling structure (3) for fixing the accelerometer on a package and a MEMS sensor chip (10) for measuring an acceleration, wherein the MEMS sensor chip (10) is supported by the decoupling structure (3) and comprises a first sensor wafer layer (11) of a semiconductor material. The decoupling structure (3) forms a bottom portion (30) for fixing the decoupling structure (3) on the package and a top portion (31) fixed to the first sensor wafer layer (11) so that the MEMS sensor chip (10) is arranged above the decoupling structure (3). A width of the top portion (31) in a first planar direction (41) is smaller than a width of the bottom portion (30) and/or of the first sensor wafer layer in the first planar direction (41). The decoupling structure (3) is made out of the same semiconductor material as the first sensor wafer layer (11). The top portion (31) and the bottom portion (30) are manufactured from the same wafer layer. The centre point of the top portion (31) in the first planar direction (41) is arranged in a central region of the bottom portion (30) in the first planar direction (41). The decoupling structure (3) is made out of the same semiconductor material as the first sensor wafer layer (11). The MEMS sensor chip (10) comprises a hermetically closed cavity (16) which includes a seismic mass (14) of the MEMS sensor chip (10) |
| priorityDate | 2017-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.