| abstract |
The invention relates to a semiconductor module (1) comprising a substrate (2), a semiconductor chip (6) which is arranged on the substrate (2), and a first connecting element (12) for electrically connecting the semiconductor chip (6) to a conductor track (7) and/or to a further component of the semiconductor module (1), wherein at least part of the first connecting element (12) lies in surface contact with the semiconductor chip (6) and the substrate (2) and also the conductor track (7) and/or the further component, and the semiconductor module (1) has a second connecting element (13) for electrically connecting the semiconductor chip (6) to the conductor track (7) and/or to the further component, said second connecting element (13) being in the form of a wire or a strip. |