| abstract |
Provided in the present invention are a halogen-free thermosetting resin composition and a prepreg, a laminate and a printed circuit board containing the same. The halogen-free thermosetting resin composition contains the following three substances as essential components, using organic solid matter in 100 parts by weight: (A) a halogen-free epoxy resin: 35-65 parts by weight; (B) polyphosphonate: 10-35 parts by weight; (C) cyanate ester: 10-30 parts by weight. The halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board containing the same which are provided in the present invention have a high glass transition temperature, excellent dielectric properties, high peel strength, high heat resistance, low water absorption and good processability, and may achieve a halogen-free flame retardant and reach the UL94 V-0 standard. |