| abstract |
A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[-X-CO-CH 2 -CN] n (1), wherein A is hydrogen or C 1 -C 12 alkyl which is unsubstituted or substituted by one or more C 1 -C 12 alkoxy groups, C 1 -C 12 alkylcarbonyl groups, C 7 -C 25 arylcarbonyl groups, hydroxyl groups, amino groups, C 1 -C 12 alkylamino groups, C 1 -C 12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes -O- or -NR 1 -, wherein R 1 is hydrogen or C 1 -C 12 alkyl which is unsubstituted or substituted by one or more Ci-Ci2 alkoxy groups, C 1 -C 12 alkylcarbonyl groups, C 7 -C 25 arylcarbonyl groups, hydroxyl groups, amino groups, C 1 -C 12 alkylamino groups, C 1 -C 12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70 °C, is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties. |