| abstract |
Provided is a resin composition which is able to be cured fast at low temperatures, while having high bonding strength (especially, high peel strength) after curing, and which is capable of suppressing decrease in the bonding strength (especially, in the peel strength) after a moisture resistance test of the resin composition after curing, while having excellent pot life. The present invention provides a resin composition which contains (A) an epoxy resin, (B) a thiol compound represented by C(CH 2 OR 1 )(CH 2 OR 2 )(CH 2 OR 3 )(CH 2 OR 4 ) (wherein each of R 1 , R 2 , R 3 and R 4 independently represents a hydrogen atom or C n H 2n SH (wherein n represents a number of 2-6); and at least one of R 1 , R 2 , R 3 and R 4 represents C n H 2n SH (wherein n represents a number of 2-6), (b) a thiol compound other than the component (b), and (C) a latent curing accelerator. |