Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b5231c81de1a546c1d6a9325c10910ce |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68354 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68368 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13113 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14687 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1469 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-14 |
filingDate |
2017-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_087af128bab548f0fe9d05ae6aefbb69 |
publicationDate |
2018-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2018075444-A1 |
titleOfInvention |
Transfer method providing thermal expansion matched devices |
abstract |
A method of transferring an integrated circuit (IC) onto an alternative substrate is provided at a wafer level to enable coefficient of thermal expansion (CTE) matching for a circuit layer to a different material. The method is executable relative to a wafer (11) with a circuit layer (12), a first major surface (121), a second major surface (122) opposite the first major surface, and a substrate (13) affixed to the first major surface. The method includes temporarily bonding a handle (14) to the second major surface, removing a majority of the substrate to expose the first major surface and bonding a second substrate (16) to the first major surface with deposited bonding material (15). |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7143182-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020068250-A |
priorityDate |
2016-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |