http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018066217-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0955bf8807610e8f0af72b9758aa4891 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 |
| filingDate | 2017-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fe300ee820e965e8a5ca68b8f842b5c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac5fd2a1d12192faaa486ea222213b1f |
| publicationDate | 2018-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2018066217-A1 |
| titleOfInvention | Electroless palladium/gold plating process |
| abstract | The present invention addresses the problem of providing an electroless palladium/gold plating process capable of forming a palladium/gold plating film selectively only on copper even on small single electrodes or narrow L/S wiring without the occurrence of defective palladium deposition. In order to solve said problem, an electroless palladium/gold plating process is characterized in being provided with: a step (S4) for adjusting the copper surface potential by immersing an insulating base material, the surface of which is provided with copper, in an aqueous sulfur-containing solution containing at least one kind of sulfur compound selected from a group consisting of thiosulfate salts and thiols; a step (S5) for performing electroless palladium plating on the insulating base material with adjusted copper surface potential to form a palladium plating film on the copper; and a step (S6) for performing electroless gold plating on the insulating base material in which a palladium plating film has been formed on the copper to form a gold plating film on the palladium plating film. |
| priorityDate | 2016-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.