| abstract |
Provided are: a photocurable resin composition capable of forming a cured product that has superior printing properties, i.e., free of oozing, streaks, etc., and superior crack resistance; a dry film having a resin layer obtained using the composition; a cured product obtained by curing the composition or the resin layer of the dry film; and a printed circuit board comprising the cured product. The photocurable resin composition contains (A) an epoxy (meth)acrylate having a urethane bond and a bisphenol AD skeleton, (B) a photopolymerization initiator, and (C) a filler. |