| abstract |
The purpose of the present invention is to provide a cleaning agent composition for resin mask detachment having superior resin mask removal properties and little waste water treatment burden. This disclosure relates to a cleaning agent composition for resin mask detachment wherein, in an embodiment: the cleaning agent composition includes an inorganic alkali (component A), an organic solvent (component B), and water (component C); the coordinates of the Hansen solubility parameter for component B are within a range of a 1.5 MPa 0.5 sphere centered on δd = 17.5, δp = 5.0, and δh = 11.5; the component C content during use of the cleaning agent composition is 85% by mass or greater; and the mass ratio (A/B) of component A to component B is 1 - 60. |