| abstract |
This (meth)acrylic resin composition is capable of achieving both storage stability in an atmosphere of 25°C and cold curing in an atmosphere of 60 to 140°C when a sealed container is used, and is also capable of exhibiting these characteristics in a conductive adhesive that contains conductive particles. The (meth)acrylic resin composition includes components (A) to (C).nComponent (A): A urethane modified oligomer having a (meth) acrylic group.nComponent (B): A monomer having a surface tension of 25 to 45 mN/m, and having in the molecule a hydroxyl group and/or a carboxyl group, and one (meth) acrylic group.nComponent (C): An organic peroxide having a specific structure. |