http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018038707-A1

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filingDate 2016-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7a5c53cc886427c0f191656e3694f6b
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publicationDate 2018-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2018038707-A1
titleOfInvention Inverted microstrip transmission lines for qubits
abstract Described herein are new transmission line structures, and methods for fabrication thereof, for use as resonators and non-resonant interconnects in quantum circuits. In one aspect of the present disclosure, a proposed transmission line structure includes a substrate, a ground structure disposed over the substrate, and a signal path (i.e. a strip of a conductive material, preferably a superconductive material) suspended over the ground structure and supported by a signal path support layer. The proposed structure further includes an opening in the signal path support layer, the opening being indicative of using the fabrication process described herein for forming the proposed structure. Transmission line structures as proposed herein could be used for providing microwave connectivity to, from, or/and between the qubits, or to set the frequencies that address individual qubits.
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