| abstract |
Provided is a resin composition which comprises (A) a polyimide resin containing diamine residues having a structure represented by general formula (1) in an amount of 60 mol% or larger of all the diamine residues, (B) a thermosetting resin, and (C) a thermally conductive filler, wherein the thermally conductive filler (C) is contained in an amount of 60 parts by volume or larger per 100 parts by volume of the sum of the polyimide resin (A), thermosetting resin (B), and thermally conductive filler (C). The resin composition can give sheets excellent in terms of heat resistance and thermal conductivity and having low moduli and excellent thermal responsiveness. |