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filingDate 2017-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2018016723-A1
titleOfInvention Semiconductor package and manufacturing method thereof
abstract The present invention relates to a method for manufacturing a semiconductor package, comprising: a first step of forming a primary solder ball on a UBM structure; and a second step of forming a secondary solder ball on a top surface of the UBM structure by performing a reflow process with respect to the primary solder ball while the side walls of the UBM structure are exposed.
priorityDate 2016-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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