| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
2017-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1239071069ae63789bab7d6fd501768 |
| publicationDate |
2018-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018012535-A1 |
| titleOfInvention |
Wiring board production method and wiring board |
| abstract |
The present invention addresses the issue of providing: a method whereby a three-dimensional wiring board having excellent self-support and abrasion resistance properties can be easily produced; and a wiring board. This wiring board production method has: a step A in which a first conductive film is prepared that has a three-dimensional shape and includes a substrate and a patterned metal layer arranged on at least one main surface of the substrate; a step B in which an abrasion-resistant layer is arranged on at least one main surface of the first conductive film and a film having an abrasion-resistant layer is obtained; and a step C in which the film having the abrasion-resistant layer is arranged upon at least one mold out of a first mold and a second mold such that the abrasion-resistant layer and one mold are facing each other, the first and second molds are clamped, resin is injected inside a mold cavity formed by the first and second molds, and a wiring board is obtained that includes the first conductive film and a resin layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020196010-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023048204-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11385745-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020196010-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023136185-A1 |
| priorityDate |
2016-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |