http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018006235-A1

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filingDate 2016-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a86cbe72e4cb6e24412a2042f759e7c
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publicationDate 2018-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2018006235-A1
titleOfInvention Self-repairing flexible printed circuit board and manufacturing method thereof
abstract Provided is a self-repairing flexible printed circuit board and manufacturing method thereof. A substrate of the circuit board is constructed using a self-repairing hydrogel-elastomer based on a dynamic borate ester link. The substrate comprises the following raw materials in parts by weight: 30-70 parts of an alkene monomer or polymer with a hydrophilic radical; 5-35 parts of an alkene monomer or polymer with a hydroxyl radical; 2-8 parts of a boron-containing compound; 15-35 parts of water; and 0.5-1 part of a free radical initiator. The dynamic borate ester link formed by a hydroxyl group and a borate group provides a self-repairing function to the hydrogel-elastomer. The borate ester link is a dynamic covalent link with the strength of a covalent bond and the reversibility and plasticity of physical cross-linking, thereby providing a material with a self-repairing function and extending a service life of the material. The invention has cheap and easily obtainable raw materials, a simple manufacturing technique, and improved combined mechanical performance.
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