abstract |
The present invention provides a curable liquid epoxy resin composition useful as underfill material for semiconductor devices, which comprises (a) an epoxy resin component, (b) a VQM resin, (c) a curing agent, and (d) a filler having an average particle size of 10 nm to 100 μηη, wherein the VQM resin is a mixture of a QM silica resin and a vinyl functionalized polydimethylsiloxane. The VQM resin can lower the storage modulus of the curable liquid epoxy resin composition after it is cured. And no phase separation is observed between the curable liquid epoxy resin composition or the cured product and the substrate, after it is cured. |