| abstract |
The method includes providing a wafer having a plurality of circuits, each of the plurality of circuits having a plurality of bond pads including a first metal; applying a coating (170) onto at least the plurality of bond pads (160); etching a hole (172) in the coating (170) on each of the plurality of bond pads (160) to provide an exposed portion of the plurality of bond pads (160); dicing the wafer to separate each of the plurality of circuits; die bonding each of the plurality of circuits to a respective packaging substrate; and performing a bonding process to bond a second, dissimilar metal (150) to the exposed portion of each of the plurality of bond pads (160) such that the second, dissimilar metal (150) encloses the hole (172) in the coating (170) of each of the plurality of bond pads (160), thereby enclosing the exposed portion. |