patent/WO-2017209043-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017209043-A1

Outgoing Links

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filingDate	2017-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43efed33fc66d94bd30d4742b5d64935 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d933483358dee40e527a5718132a394 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cfaa780725cf30c061225613283052f
publicationDate	2017-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	WO-2017209043-A1
titleOfInvention	Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
abstract	This resin composition for an underfill material contains a maleimide compound (A) and a secondary monoamino compound (B), wherein said secondary monoamino compound (B) has a boiling point of greater than or equal to 120°C.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023066153-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020262586-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200125746-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102192274-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3467028-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3786200-A4
priorityDate	2016-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226395003 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5770

Total number of triples: 63.