| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-031 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2017-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e56df7f0bda552e61e9c3e4565284417
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36ec5473025a8fb9c65346ffa30cd7c3 |
| publicationDate |
2017-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017203746-A1 |
| titleOfInvention |
Semiconductor apparatus and method for manufacturing same |
| abstract |
A semiconductor apparatus (1) is provided with: a first substrate (5) that has a first surface (6); a semiconductor element (7); a first flexible connection member (33) that is electrically connected to the semiconductor element (7); a first pad (30) that is connected to the first flexible connection member (33); and a second substrate (10) that includes a bump (15) and a wiring line (12). The second substrate (10) is a low-temperature sintered ceramic substrate (11) that includes alkali metal ions. The first pad (30) is coupled to the wiring line (12) via the bump (15). In a plan view from a direction along the normal of the first surface (6), at least a part of the first pad (30) is superposed on the semiconductor element (7). Thus, the semiconductor apparatus (1) can be miniaturized. |
| priorityDate |
2016-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |