| abstract |
This thermosetting resin composition for LDS contains a thermosetting resin, an inorganic filler, a non-conductive metal compound that forms a metal nucleus upon irradiation of an active energy ray, and a coupling agent. The non-conductive metal compound contains: a spinel-type metal oxide; a metal oxide having two or more transition metal elements in groups adjacent to each other, said groups being selected from among group 3 to group 12 of the periodic table; and one or more oxides selected from among tin-containing oxides. The coupling agent contains one or more compounds selected from the group consisting of mercapto silanes, amino silanes and epoxy silanes. |