| abstract |
A sensor assembly for being mounted on a circuit board (CB) comprises an interposer (I) with at least one opening (01, 02, 03, 04) extending between a first and a second main surface (MS1, MS2) of the interposer (I). The interposer (I) comprises at least two stress decoupling elements, each comprising a flexible structure (F1, F2, F3, F4) formed by a respective portion of the interposer (I) being partially enclosed by one of the at least one opening (01, 02, 03, 04). A sensor die (S) is connected to the flexible structures (F1, F2, F3, F4) on the first main surface (MS1). At least two board connection elements (SB) are arranged on the first main surface (MSI) and adapted for connecting the assembly to the circuit board (CB). |