| abstract |
The purpose of the present invention is to provide a curable resin composition from which a cured product having low tack and having excellent gas-barrier characteristic, heat resistance, and light resistance is formed. The curable resin composition includes: a component (A) which is a polyorganosiloxane represented by an average unit formula of (SiO 4/2 ) a1 (R 1 SiO 3/2 ) a2 (R 1 n 2 SiO 2/2 ) a3 (R 1 n 3 SiO 1/2 ) a4 [wherein each R 1 is an alkyl, an aryl, an alkenyl, or the like, the percentages of alkyl, aryl, and alkenyl with respect to the total amount of R 1 are 50-98 mol%, 1-50 mol%, and 1-35 mol%, respectively, and a1>0, a2>0, a3≥0, a4>0, 0.5≤a1/a2≤10, and a1+a2+a3+a4=1 are satisfied.]; a component (B) which is a polyorganosiloxane represented by an average compositional formula of R 2 n m H n SiO [(4-m-n)/2] [wherein R 2 is an alkyl or an aryl, and 0.7≤m≤2.1, 0.001≤n≤1.0, and 0.8≤m+n≤3 are satisfied.]; and a component (C) which is a hydrosilylation catalyst. |