| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a7b097bfd3f350ed27ffa53e1f114d1a |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B26D1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61L31-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B18-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B26D1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B18-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61L31-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00 |
| filingDate |
2017-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_943c02e50bcf0d2983e70ed23a73c69c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce25dde0aaae25d6aded5c1b7ada9899
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ec40c158d68e5dc87ff54a6fe28547d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db0c5d20a67d266f32928417cda7ea06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d16ae0bedb06ec15a09ac544ec692f4 |
| publicationDate |
2017-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017145842-A1 |
| titleOfInvention |
Adhesion prevention film for medical devices and medical device |
| abstract |
This adhesion prevention film for medical devices is a single-layer or multilayer adhesion prevention film that is formed on the surface of a medical device. This adhesion prevention film for medical devices comprises an outermost layer that contains a plurality of conductive particles and a resin having a continuously usable temperature of 200°C or higher. The surface of the outermost layer is provided with recesses and projections by having parts of the plurality of conductive particles exposed from the resin. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019078089-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018088306-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019072332-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7289993-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019082765-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021053996-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019078275-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021059780-A1 |
| priorityDate |
2016-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |