| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_78941ed5a01bfbcd48376e1fdb485b19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_74386673bce3c3db388e0ee7a323935b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0685
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-302 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B8-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B06B1-06 |
| filingDate |
2017-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27c48f8b30c49fcc4088c5c0e2e80c89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07d027bb46924513124adf766a7af1f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a08b78a258df13d05e5f9f068ec0721e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82a9775e1ecb27245121a72f40b7edb0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3051c0147ed14efb662eb03f32c0ce30 |
| publicationDate |
2017-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017143307-A1 |
| titleOfInvention |
Modular piezoelectric sensor array with co-integrated electronics and beamforming channels |
| abstract |
A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2614239-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019222116-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021014222-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11679975-B2 |
| priorityDate |
2016-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |