http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017142978-A1

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552
filingDate 2017-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64eb5e3fa16dcf5de45373c92afb3374
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publicationDate 2017-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2017142978-A1
titleOfInvention Emi shielded integrated circuit packages and methods of making the same
abstract An integrated circuit package with a plurality of embedded electromagnetic interference (EMI) shielding and methods of making the same are disclosed. The integrated circuit packages include the use of a pre-assembled circuit module and an interposer. The circuit module has a plurality of spaced electrical component sections separated by a series of contiguous conductive spacers, and a first shielding means comprises the spacers, vias and an embedded conductive plane. In an example, the interposer has a second shielding means comprises conductive cavities, conductive ridges, vias, and a conduction pattern. In another example, the interposer further comprises conductive strips to form the second shielding means. The first shielding means overlaps the second shielding means to form a plurality of EMI shielded enclosures for holding the spaced electrical component sections therein.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019066870-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11710708-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023023238-A1
priorityDate 2016-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 31.