| abstract |
A polishing composition including abrasive grains, an additive, and a water-soluble polymer, wherein the polishing composition has a ratio of D 50 (after) to D 50 (before) of less than 2.0; here, D 50 (before) is the D 50 value of particles of the polishing composition measured before allowing the polishing composition to stand for five days at 80°C, and D 50 (after) is the D 50 value of particles of the polishing composition measured after allowing the polishing composition to stand for five days at 80°C. |