| abstract |
The invention relates to an assembly comprising: - at least one first element (100) comprising at least one first electrically connecting contact pad (12); - at least one second element (200) comprising at least one second electrically connecting contact pad (21); and electrically and mechanically interconnecting means, characterised in that said electrically and mechanically interconnecting means comprise at least: - at least one first metal intermediate interconnecting element (13), on the surface of at least the first electrically connecting contact pad; - at least one sintered joint of metal microparticles or nanoparticles, which joint is stacked on top of the first metal intermediate interconnecting element; - the melting point of the first metal intermediate interconnecting element being above the sintering temperature of the metal microparticles or nanoparticles. The invention further relates to a process for manufacturing an assembly according to the invention. |