| abstract |
Provided is a cured film having high chemical resistance, high elongation properties and high adhesion to copper metal.nA cured film which is obtained by curing a photosensitive resin composition containing a polybenzoxazole precursor, and which is characterized in that the ratio of the polybenzoxazole precursor that has been ring-closed to a polybenzoxazole is from 10% to 60% (inclusive). |