| abstract |
To provide a resin composition having excellent thermal conductivity. Especially, to provide: a liquid crystal polymer composition which is suitable for the formation of a semi-cured heat transfer film that has excellent thermal conductivity, bondability and low-temperature processability; and a circuit board which uses this liquid crystal polymer composition. Additionally, to provide a curable resin composition which has bonding strength in addition to high thermal conductivity. A resin composition which contains (á) a curable compound, (â) a curing agent, (ã) a liquid crystal polymer that forms a liquid crystal phase at 190°C or less, and (ä) a filler. Specifically, the above-described resin composition which is a liquid crystal polymer composition containing (I) a compound having two or more epoxy groups in each molecule, (II) a curing agent, (III) a fine powder of a liquid crystal polymer that forms an anisotropic melt form at 190°C or less, (IV) a heat transfer filler and (V) a solvent. In addition, the above-described resin composition which is a curable resin composition composed of the following components (A), (B), (C), (D) and (E): (A) a thermoplastic resin having a specific structure; (B) a curable resin; (C) a curing agent; (D) an elastomer; and (E) an inorganic filler. |