abstract |
The purpose of the present invention is to provide a photosensitive resin composition that has excellent pattern processability and that is endowed with sufficient resistance to chemicals and adhesion to substrates even by low-temperature curing at 150℃ or below. The present invention is a photosensitive resin composition containing (A) an unsaturated ethylene group- and carboxyl group-containing photoreactive resin, (B) an epoxy compound, (C) a polyfunctional epoxy compound, and (D) a photoinitiator. |