| abstract |
The invention provides a thermosetting resin composition, a pre-preg, a metal foil-coated laminated board, and a printed circuit board. The thermosetting resin composition comprises epoxy resin, an inorganic filler, and a silane coupling agent that has the structure shown in Formula I. Because the thermosetting resin composition contains the silane coupling agent having the structure in Formula I, the silane coupling agent reacts with the epoxy resin and the filler in the composition to provide the composition with a desirable binding force. When silane coupling agents that have the structure in Formula I and a structure in Formula II are both used in the resin composition of the invention, peeling strength and inter-layer peeling strength can be further increased. |