Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14335 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1434 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1431 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0649 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-1083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0886 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823431 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336 |
filingDate |
2015-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab248720528bf8c5c4212fa8d4528d5f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1fa1c8944ead4b5c138f4ae88411558 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5443996ae8bd1eff1a8e426f0a034478 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c0caf172637daa6189786acacb13fbb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74b86f4ffef9fddea9967d964a3a4813 |
publicationDate |
2017-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2017105471-A1 |
titleOfInvention |
Backside isolation for integrated circuit |
abstract |
Embodiments of the present disclosure describe techniques for backside isolation for devices of an integrated circuit (IC) and associated configurations. The IC may include a plurality of devices (e.g., transistors) formed on a semiconductor substrate. The semiconductor substrate may include substrate regions on which one or more devices are formed. Trenches may be disposed between the devices on the semiconductor substrate. Portions of the semiconductor substrate between the substrate regions may be removed to expose the corresponding trenches and form isolation regions. An insulating material may be formed in the isolation regions. Other embodiments may be described and/or claimed. |
priorityDate |
2015-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |