| abstract |
The present invention provides an epoxy resin composition which is suitable as an under-fill material for three-dimensional packaging, and has a low uranium content and excellent filling properties, and in which the occurrence of voids is inhibited. The epoxy resin composition according to the present invention contains (A) a liquid epoxy resin, (B) a curing agent, and (C) an alumina filler, and is characterized in that alumina filler (C) has an average particle size of 0.1-4.9 µm, and the uranium content is 0.1-9 ppb. |