abstract |
A gypsum board composition was disclosed which comprises stucco, adhesive, water and additive for improving bonding, wherein the additive for improving bonding is shown in chemical formula as M Ⅰ M Ⅱ (OH) 2 (A n- )·mH 2 O,wherein M Ⅰ is a divalent metal ion, M Ⅱ is a trivalent metal ion, and A n- is an interlayer anion, and wherein M Ⅰ and M Ⅱ are different metals. Also, a gypsum board made with the composition of the above and a method for using a compound shown in the aforesaid chemical formula were disclosed. |