| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c20dac5f1a44475c96d2db944e79786 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-34924
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-523
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-523
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3477 |
| filingDate |
2016-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0987d78101f856ea829c500a0f22940e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd5bece3934d974c9767a2d6264895ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dabc5ee28471be6ba25dfff5413ada5f |
| publicationDate |
2017-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017094489-A1 |
| titleOfInvention |
Thermally curable resin composition, thermally curable resin film, printed wiring board, and semiconductor device |
| abstract |
The purpose of the present invention is to provide a thermally curable resin composition which is capable of forming an insulating film having excellent dielectric properties, high flame retardancy, and high adhesive force, without requiring the use of any conventional halogen-compound flame retardant.nThe thermally curable resin composition is characterized by comprising (A) an aromatic polyphosphate ester, (B) melamine cyanurate, and (C) a resin having a relative permittivity of 2.9 or less at a frequency of 1.9 GHz, the sum of the components (A) and (B) being 45 parts by mass or more per 100 parts by mass of the component (C), and the content of the component (A) being higher than that of the component (B). It is preferable that the thermally curable resin composition have a relative permittivity of 3.0 or less at a frequency of 1.9 GHz. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7269665-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3835366-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110709476-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112533995-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020031495-A1 |
| priorityDate |
2015-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |