| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49805 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-02133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-0509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-049
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-02102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-02086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 |
| filingDate |
2016-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c5a4c7e9aa03a8bac9bb6f25f620376
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3bcf3b9a1d7624c499e35fce14237ce3 |
| publicationDate |
2017-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017090508-A1 |
| titleOfInvention |
Package for housing electronic component, electronic device, and electronic module |
| abstract |
A package for housing an electronic component includes: a base having a first main surface that has a part for mounting an electronic component; a frame having a second main surface, said frame being provided on the the base so as to surround the mounting part; a frame-shaped metallized layer provided on the second main surface of the frame; and a side-surface conductor via which the frame-shaped metallized layer and a relay conductor formed on the first main surface are connected, said side-surface conductor being provided on the inner side surface of the frame. An insulation film covers from one end to the other end in the width direction of the side-surface conductor. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020262472-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11011695-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7021919-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11116077-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7182712-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019192825-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020262472-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019097105-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7075810-B2 |
| priorityDate |
2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |