abstract |
Provided are an epoxy resin composition which can have a sufficiently low viscosity without using a diluent (organic solvent), and a method for producing the composition. Also provided are an epoxy resin composition which preferably has, when being cured, excellent electrical characteristics (particularly, a low permittivity and a low dielectric loss tangent), a high adhesion strength to metal, and excellent water absorption characteristics, and a method for producing the composition. |