| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a6a73440018eca5d3e92ae110c26dbb1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2371-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2483-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-485 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J171-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12 |
| filingDate |
2016-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a194bbc072d8b680172101ba8d84fae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ea75628362039d93453e0191058d9ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2798a8e28f927210bed270b91e55397 |
| publicationDate |
2017-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017067123-A1 |
| titleOfInvention |
Polyphenyl ether resin composition and use thereof in high-frequency circuit substrate |
| abstract |
The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has a high glass-transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate of high-speed electronic equipment. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019130735-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11078329-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7203386-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I732733-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019130735-A1 |
| priorityDate |
2015-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |