abstract |
A passivation-layer forming composition according to the present invention contains a compound represented by M(OR 1 ) m [where, M represents at least one type selected from the group consisting of Al, Nb, Ta, VO, Y, and Hf, R 1 independently represents an alkyl group or an aryl group, and m represents an integer from 1 to 5] and water, is applied to a semiconductor substrate by using printing, and forms a passivation layer having a mean thickness of 200 nm or less after heat treatment. |