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inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_673456a12da9e6b3dfe851a64f0d3eda
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publicationDate 2017-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2017059256-A1
titleOfInvention Mechanical advantage in low temperature bond to a substrate in a thermoelectric package
abstract A thermoelectric system is disclosed which comprises a hot-side substrate comprising a first dielectric material, a cold-side substrate comprising a second dielectric material, a plurality of thermoelectric element pairs positioned intermediate the cold-side substrate and the hot-side substrate, and a bonding material circuit. The bonding material circuit comprises the thermoelectric element pairs directly bonded by an electrically conductive bonding material to the cold-side and/or the hot- side substrate. Methods of making a thermoelectric system are also disclosed.
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