| abstract |
[Problem] The purpose of the present invention is to provide a composition for forming a resin thin film, for obtaining a resin thin film, particularly a resin thin film that is suitable as a substrate for a flexible device, whereby the resin thin film not only has excellent heat resistance and solvent resistance, but also has the feature of low retardation. [Solution] The present invention is: a composition for forming a resin thin film, including a polyimide, silicon dioxide particles having an average particle diameter of 100 nm or less calculated from a specific surface area measured by a nitrogen adsorption method, a crosslinking agent, and an organic solvent; and a resin thin film formed from the composition for forming a resin thin film. |