| abstract |
Provided is an alkali developable negative photosensitive resin composition which enables the achievement of a cured film that has a patterned shape with high resolution and low taper, while exhibiting excellent heat resistance and excellent light blocking properties. This negative photosensitive resin composition is characterized by containing (A1) a first resin, (A2) a second resin, (C) a photopolymerization initiator and (D) a coloring agent, and is also characterized in that: the first resin (A1) is composed of (A1-1) a polyimide and/or (A1-2) a polybenzoxazole; the second resin (A2) is composed of one or more substances selected from among (A2-1) a polyimide precursor, (A2-2) a polybenzoxazole precursor, (A2-3) a polysiloxane, (A2-4) a cardo resin and (A2-5) an acrylic resin; and the content ratio of the first resin (A1) in 100% by mass of the total of the first resin (A1) and the second resin (A2) is within the range of 25-90% by mass. |