| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3082cd39bb800686b9abbb8aa05c80b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D18-0045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 |
| filingDate |
2016-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17da97d1fc1d91b82c1be7d15c469d33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_201935e3749b14da7261d8306622c7bd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e6ff7cd8b4f833331f09711671f6655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d2b4dbb3ab73f1bd3dace62fdccd919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c94a4f7978085a924b5b9c95264e233 |
| publicationDate |
2017-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017053685-A1 |
| titleOfInvention |
Polyurethane cmp pads having a high modulus ratio |
| abstract |
A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C to storage modulus at 80 degrees C of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C of 1200 MPa or more, and/or a storage modulus at 80 degrees C of 15 MPa or less. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021011260-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I791157-B |
| priorityDate |
2015-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |