http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017049217-A1

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filingDate 2016-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2017-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2017049217-A1
titleOfInvention System, apparatus and method for utilizing surface mount technology on plastic substrates
abstract An apparatus, system and method for forming a molded plastic substrate product for an electronic circuit for a device, wherein the substrate may include one or more electrically conductive traces that are plated and formed on a laser-etched, activated portion of the molded plastic substrate defining each electrically conductive trace. One or more electrically conductive pads may be placed at one or more predetermined positions at the one or more electrically conductive traces. An electrical component surface may then be mounted to the at least one electrically conductive pad using conductive bonding material.
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