http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017048071-A1

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filingDate 2016-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_180d34818ba451dc12ff6f799f72fd81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3265acdbe1dc835a7fd0a0e8f66d3c7d
publicationDate 2017-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2017048071-A1
titleOfInvention Superhydrophobic mold, manufacturing method thereof, superhydrophobic material using superhydrophobic mold, and manufacturing method thereof
abstract The present invention relates to a method for manufacturing a superhydrophobic mold, a superhydrophobic material using a superhydrophobic mold, and a method for manufacturing the same, the method comprising the steps of: bonding a photoresist to a metal surface for a mold; exposing the photoresist to light through lithography to form a photosensitive micropattern; forming a first anodized layer on the photosensitive micropattern through anodic oxidation; etching and removing the first anodization layer to form an anodized micropattern including a nanoseed, which is recessed deeper than the photosensitive micropattern; forming a second anodization layer including an anodized nanopattern on the anodized micropattern including a nanoseed through anodic oxidation; and etching the anodized nanopattern formed of nanopores to adjust the diameter and dent depth of the nanopores. As a result, the etching process and the anodic oxidation process are not performed in order to obtain an anodized micropattern, so that the process can be simplified. Thus, the manufacturing cost and the manufacturing time can be reduced. Also, the anodic oxidation maintains a bonding force between the photoresist and the metal, and the micropattern depth can be increased by controlling the anodization time.
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priorityDate 2015-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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