| abstract |
The present invention provides a resin composition which can be thermally cured at a temperature of approximately 80°C and exhibits excellent PCT resistance, and is therefore suitable as a one-component adhesive used when producing an image sensor module or electronic component. This resin composition is characterized by containing (A) an epoxy resin, (B) a compound represented by formula (1), (C) a curing accelerator and (D) a silane coupling agent, and characterized in that the content of the compound of component (B) is 1:0.3 to 1:2.5 in terms of equivalence ratio of epoxy groups in the epoxy resin of compound (A) to thiol groups in the compound of component (B), the content of the silane coupling agent of component (D) is 0.2-60 parts by mass relative to a total of 100 parts by mass of components (A), (B), (C) and (D), and the equivalence ratio of thiol groups in the compound of component (B) to Si in the silane coupling agent (D) is 1:0.002 to 1:1.65. |