| abstract |
A sensing chip encapsulation component and an electronic device with same. The sensing chip encapsulation component comprises: a metal substrate (100) which has a pad region (11) and a placement region (12), wherein the pad region has a plurality of metal pads (13); a sensing chip (200) which is located on an upper surface of the metal substrate, wherein the sensing chip has a plurality of sensing chip pads (21); an electrical connection component (300) which is electrically connected to the metal pads and the sensing chip pads; and an encapsulation material cover member (400) which covers the metal substrate, the sensing chip and the electrical connection component, wherein any two adjacent metal pads are isolated and spaced by means of the encapsulation material cover member.The sensing chip encapsulation component has the advantages of a short development cycle and slight warping, thereby improving the subsequent assembly efficiency while saving costs; in addition, since a plurality of metal pads on a metal substrate are mutually independent, independent transmission of a plurality of signals between a sensing chip and the metal substrate can be implemented, thereby significantly reducing the risk of interference between the plurality of signals. |